A new standard could let companies build processors out of Lego-like chiplets
The world's biggest chipmakers are coming together to create a new Universal Chiplet Interconnect Express (UCIe) system for integrating chiplets together in future semiconductor designs. Virtually every major name in processor technology is onboard with the standardization effort, including foundry owners like Intel, TSMC, and Samsung and major players in semiconductor-adjacent spaces, like AMD, Arm, Qualcomm, Meta, Google Cloud, and Microsoft.
https://www.theverge.com/2022/3/2/22958049/ucie-chiplet-standard-processors-soc-intel-tsmc-samsung-arm