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3D-IC

Creator
Creator
Seonglae Cho
Created
Created
2024 Jul 16 7:20
Editor
Editor
Seonglae Cho
Edited
Edited
2024 Jul 16 7:20
Refs
Refs

3D Integration

3D Integrations
TSV
2.5D Packaging
 
 
 
Three-dimensional integrated circuit
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections,[1] so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Three-dimensional integrated circuit
https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit
 
 

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3D-IC
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