The Tech Behind Apple's M1 UltraFusion Chip Interconnect
Building high-performance microprocessors is getting trickier and more expensive these days, which is why developers have to opt for sophisticated packaging technologies with designs aimed at performance-hungry applications. Apple admits that to make its M1 Ultra processor it had to fuse two M1 Max system-on-chips together, but what it didn't say is that it had to use one of TSMC's most advanced packaging technologies to build the M1 Ultra.
https://www.tomshardware.com/news/apple-uses-cowos-s-to-build-m1-ultra
