Seonglae Choimportant for AI memory
High-Bandwidth Memory: The Critical Gaps in US Export Controls | AI Frontiers
Erich Grunewald, Feb 02, 2026 — Modern memory architecture is vital for advanced AI systems. While the US leads in both production and innovation, significant gaps in export policy are helping China catch up.
https://ai-frontiers.org/articles/high-bandwidth-memory-critical-gaps-us-export-controls
“다이!!, 1a 1b 1c? 이 외계어 도대체 뭐야”…HBM 용어 한 번에 끝 [위클리반도체] - 매일경제
반도체 용어, 주가 출렁일 때 핵심 반도체 용어, 이제는 쉽게 이해하자
![“다이!!, 1a 1b 1c? 이 외계어 도대체 뭐야”…HBM 용어 한 번에 끝 [위클리반도체] - 매일경제](https://static.mk.co.kr/favicon_new.ico)
https://www.mk.co.kr/news/it/11143061
![“다이!!, 1a 1b 1c? 이 외계어 도대체 뭐야”…HBM 용어 한 번에 끝 [위클리반도체] - 매일경제](https://pimg.mk.co.kr/news/cms/202410/20/news-p.v1.20241017.50947077be984cd9a9676e0396e7d1f6_R.png)
microLED-based Optical interconnects Optical Fiber, Optical Computing
It is ideal for these short-distance applications.
TSMC Bets on Unorthodox Optical Tech
In a bold move, TSMC partners with Avicena to revolutionize AI data centers using microLED-based interconnects. Ditching lasers for LEDs, this tech promises energy efficiency and lower costs, at the expense of more fibers. Could this be the future of AI scale-up networks? #AI #Innovation
https://spectrum.ieee.org/microled-optical-chiplet
3d zHBM
Samsung Unveils 3D-Memory Roadmap to Boost AI Hardware Performance
Samsung Electronics Co. offered a glimpse of its most advanced memory hardware, touting improved performance and power efficiency in a bid to overtake rivals SK Hynix Inc. and Micron Technology Inc. in the race for long-term dominance.
https://www.bloomberg.com/news/articles/2026-08-04/samsung-reveals-new-3d-memory-roadmap-in-bid-for-ai-tech-lead
